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ECD Introduces 20-Channel M.O.L.E.™ EV20 Touchscreen […]

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ECD Introduces 20-Channel M.O.L.E.™ EV20 Touchscreen Thermal Profiler

Latest EV-series M.O.L.E.™ Brings Touchscreen Thermal Profiling Productivity to High-Density, High-Reliability Assemblies.

November 14, 2023 – ECD announced today that it has developed a new 20-channel M.O.L.E.™ touchscreen thermal profiler for high-value, high-reliability electronic assemblies that require multiple thermal measurements. The M.O.L.E.™ EV20 is the second product in ECD’s EV-series thermal profilers, built on the market’s only profiling platform with full-color touchscreen control. M.O.L.E. EV20 replaces the company’s MEGAM.O.L.E.™ 20 and delivers significant ease-of-use and technological enhancements.

Foremost among the M.O.L.E. EV20’s productivity benefits is the process control immediacy it offers operators. Thermal profiles can be seen in real time, allowing corrective actions if required. By contrast, other thermal profilers require a PC data download, which adds time and complexity to the process. Calculation templates, configuration, profile selection and modification, and pass/fail analysis are all managed through the intuitive, handheld touchscreen M.O.L.E. EV20. The ability to interact with and control the profiler on the shop floor helps reduce required operator training, limits errors, and raises efficiency.

While the touchscreen management capability is the most significant element of the redesign, the new M.O.L.E. EV20 has also integrated user-friendly and economical features compared to its predecessor, as ECD Electronics Division, Mark Waterman explains: “We wanted to use the new platform as an opportunity also to add simplicity and cost-effectiveness to high channel count capability. For example, M.O.L.E. EV20 uses standard mini-connectors as opposed to proprietary thermocouple inputs, has universal USB C charging, Bluetooth® wireless connectivity, an off-the-shelf battery, two-button on/off and record control, and built-in maintenance reminders. Moreover, our unique design has maintained the same thermal barrier thickness and width as MEGAM.O.L.E. 20.”

The dimensions of M.O.L.E. EV20 are notable because the thin, narrow profile allows the data logger to comply with all reflow oven clearance restrictions while allowing 20 measurements to be collected in a single run. This is not the case with all multi-input profiling options. With other profilers, the device design is very thick to accommodate high channel counts, or multiple runs must be conducted to collect the numerous readings required for densely populated, high-value PCB assemblies.

“Our engineering team thoughtfully designed M.O.L.E. EV20 with the operator’s perspective in mind,” Waterman explains. “We’re confident our newest touchscreen EV profiler ticks all the boxes.”

Discover more here.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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ECD to Showcase New M.O.L.E.™ EV6 Features, Preview Expanding […]

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ECD to Showcase New M.O.L.E.™ EV6 Features, Preview Expanding Touchscreen Thermal Profiling Portfolio at productronica 2023

M.O.L.E.™ EV6, the Market’s Only Touchscreen Thermal Profiler, Adds Bluetooth® Capability and Welcomes New Additions to the Portfolio

October 16, 2023 – Since the launch of the first-ever touch control thermal profiler, M.O.L.E.™ EV6, ECD’s new tool has enjoyed wide industry uptake and has recently integrated additional features like Bluetooth® wireless connectivity. The company announced today that during productronica 2023 in Hall A4, Booth 246/3, visitors can experience M.O.L.E. EV6 first-hand, see a preview of soon-to-be-launched profilers, demo OvenSENTINEL™ reflow monitoring technology, and learn more about the scalable RIDER soldering equipment verification portfolio.

“Maximum productivity and expansive data are the keys to process efficiency and product quality,” says ECD Electronics Division Manager, Mark Waterman. “ECD’s objective from its founding has been to deliver on these elements through robust measurement, monitoring, and analysis technologies. As the market has evolved and data acquisition and presentation made more seamless, our product line has followed suit. The ability to view and act on information immediately through M.O.L.E. EV6’s touchscreen visibility and OvenSENTINEL’s real-time reflow monitoring are two examples that have demonstrated measurable improvements in yield, quality, and cost-efficiency. For ECD, this is a journey, and we continue to add features to existing technologies and bring new solutions to the industry. We’re excited to showcase many of these at productronica 2023.”

Expanding on M.O.L.E. EV6’s feature set, ECD has integrated Bluetooth wireless technology to enable remote data acquisition of real-time profile conditions through its M.A.P. software. This Bluetooth capability, ECD’s scalable WaveRIDER™ NL 2, OvenRIDER™ NL 2+, and SelectiveRIDER™ sensor products, and the company’s OvenSENTINEL reflow soldering continuous monitoring software will be demonstrated throughout the four-day productronica event.

With the M.O.L.E. EV platform exceeding expectations, ECD has accelerated its planned rollout of additions to the EV-generation profiler portfolio. Currently in development, new high channel count tools will offer more flexibility for the demanding process needs of each customer and address market-specific requirements. Visitors to ECD’s productronica exhibit can see a preview of the new technologies, which are set to be commercialized in early 2024.

“Particularly for high-value, high-reliability PCBs destined for mission-critical applications like automotive, aerospace, alternative energy, and high-performance computing, expanded thermal profile data points are required to ensure compliant, fail-safe manufacturing,” says Waterman. “Our newest EV-series M.O.L.E.s will offer this capability, and we look forward to sharing them with the market soon!”

To schedule time with ECD’s technology team at productronica 2023, email mike.hayward@ecd.com. Learn more about ECD’s electronic process control technologies by visiting www.ecd.com.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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ECD’s Touchscreen Profiling Technology to be […]

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ECD’s Touchscreen Profiling Technology to be Highlight of iba 2023 Exhibit

M.O.L.E.™ EV6 Thermal Profiler Offers Data Access on the Bakery Floor, Integrates with Quality Control Sensors for Scalable Solution

October 2, 2023 – ECD will bring its groundbreaking thermal profiling technology to the iba trade fair in Munch, Germany later this month, the baking process control leader announced today. The handheld M.O.L.E.™ EV6 sets a new benchmark for thermal data loggers, elevating the tool to modern technology standards with a full color touchscreen display to deliver instantaneous data access and intuitive control. In addition to the six-channel M.O.L.E. EV6, the company’s BreadOMETER™, CakeOMETER™, and OvenBALANCER™ sensors will be demonstrated from iba Hall B1, Stand 124

Thermal profiling of baked goods and verification of oven performance are key ingredients for product consistency, quality, shelf-life optimization, and yield maximization. Understanding product thermal transformation and oven heat flow consistency through precise time and temperature data capture can help bakeries streamline production and preserve profitability. The M.O.L.E. EV6 now enables bakers to take this advantage further, delivering the data immediately so that adjustments can be made in real-time, and errors avoided.

Ray Pearce, ECD Baking Product Manager, has worked with bakers for over 30 years, helping them integrate thermal profiling methodologies into their operations. He comments on how the company’s latest innovation can streamline baking results. “With conventional thermal profilers, data is not viewable on the tool itself,” says Pearce. “Only after download to a PC are you able to make adjustments, which delays corrective measures. Now, M.O.L.E. EV6 enables access to information like S-Curve milestones and various profiling analysis tools in the palm of your hand, on the bakery floor, so immediate remedies can be implemented.”

CD’s M.O.L.E. platform is the data capture engine for its portfolio of sensor technologies, including BreadOMETER, CakeOMETER, and OvenBALANCER, which will all be displayed and demonstrated throughout iba 2023.

To discover more about ECD’s proven baking process control solutions, visit www.ecd.com/industires/baking.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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Press Release: ECD Engineering Team Expands […]

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ECD Engineering Team Expands with Addition of Software Development Engineer

New Hire Aims to Streamline Current Offerings and Develop New Ground-Up Software Backbone for Company’s Next-Gen Product Line.

September 18, 2023 – ECD today announced that Seydina Diop has joined the company’s growing engineering team as a Software Engineer II. This is the second ECD engineering hire in less than a year, as the company has committed to – and is achieving – an accelerated product development roadmap.

Diop, an experienced full-stack software developer who has been writing code since childhood, brings over ten years of experience to the ECD team. He previously worked for an online design goods marketplace where he managed the company’s social media presence and provided technical support, metrics analysis, and troubleshooting to improve the user experience. His unique skill set unites back-end and front-end technical knowledge with artistic presentation, bringing operational robustness and user perspective to his craft.

“I describe myself as having an engineer’s brain with an artist’s eye,” comments Diop. “It’s one thing to understand and be able to develop technically sound code. It’s quite another to marry that skill with artistic conceptualization to ensure the user experience is visually rich, intuitive, and consistent across multiple platforms. That’s what I intend to help deliver for ECD users.”

Initially focused on enhancements to the company’s popular OvenSENTINEL™ continuous reflow soldering monitoring technology, Diop’s future assignments include the development of baking-centric profiling software, portfolio-wide MAP profiling software upgrades, and adding customer-requested features to several popular ECD products.

Micheal Pliska, ECD Director of Engineering, says, “Seydina is a great addition to our team, allowing us to bring key software responsibilities in-house which has tightened the feedback loop and enabled fast implementation. He’s already been instrumental in adding OvenSENTINEL product support for global regions and has begun working on major upgrades to other ECD product lines.”

Diop holds a B.S. in computer science and is proficient in multiple front-end, back-end, and database programming languages, including HTML, CSS, JavaScript, Python, C#, C++, and SQL, among others. He is based in ECD’s Milwaukie, Oregon headquarters.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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Technical Article: The Impact of Thermocouple Attachment […]

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The Impact of Thermocouple Attachment Methods on Thermal Profiling Accuracy

By Mark Waterman, Mike Hayward, and Oscar Gomez, ECD

High-reliability electronics manufacturing relies heavily on thermal profiling to ensure reflow soldering process parameters are correctly determined and maintained during printed circuit board (PCB) production.

Establishing the correct thermal profile to meet solder paste specifications, component constraints, and equipment
capabilities involves the measurement of a product sample. To capture specific temperature measurements, thermocouples are attached at strategic points on the PCB and are connected to a thermal profiler that records the data. Measurements are taken, and any required machine setting adjustments are made until satisfactory results are achieved. This may take one profiling operation or several attempts before the specification is reached.

Though process control methods for specification adherence can take many forms, the most common

approach is repeated thermal profiling of the product sample used in the initial setup. The product sample is often referred to as the “Golden Sample” or the “Golden

Figure 1: test vehicle
(aluminum tape attachment).

Board” and is re-measured periodically, and results are compared to the baseline profile initially established.

Achieving and maintaining accurate temperature readings is vital at both the initial product profile

and subsequent verification profiles. Precise temperature measurements are largely influenced by the method of thermocouple attachment, underscoring the importance of an attachment using a medium that ensures accuracy. Direct surface-to-surface contact between the measured solder pad and thermocouple tip is vital. Thermal conductivity should be maximized between the two surfaces and minimized at the mass around the connection.

Mechanically, the interface needs to be strong enough to ensure the thermocouple does not detach throughout the reflow soldering process and, in the case of a “Golden Sample,” can withstand storage, handling, and several passes through the process over several months (or even years).

Thermocouple Attachment

There are several thermocouple attachment methods currently used in the electronics industry. A recent study set out to better understand the accuracy performance of each of them, draw comparisons, and establish which method performs best against the criteria stated above.

A set of experiments was designed specifically to analyze the following thermocouple attachment methods: high-temperature solder; polyamide (Kapton) tape;
aluminum tape; UV-cured adhesive; and low-temperature cure surface-mount (SMD) adhesive.

A PCB was designed and manufactured with an array of solder pads of differing sizes consistent with a typical SMT product. Holes were included in the PCB to allow for routing and wire stress relief. Thermocouples were attached to points on the PCB using each of the attachment methods listed above. A new PCB was used for every measurement and a control thermocouple, employed to provide a baseline, was attached to the same 1.0 mm pad on every PCB using high-temperature solder (Figure 1).

A reflow soldering oven was set up to produce a typical lead-free solder profile. No changes to the machine parameters were made during the experiments, and a capability study using 30 sample boards was conducted to ensure the settings were stable and repeatable. The peak temperature of the control pad, with the thermocouple tip attached using high-temperature solder, returned an average temperature of 257.8°C with a standard deviation of 0.5°C.

Cp and Cpk values of 1.0 were reported with upper and lower control limits of three standard deviations (+/-1.50°C). Based on these results, the test procedure was deemed valid (Figure 2).

All attachment types, except for the UV adhesive, offered good mechanical strength with no detached thermocouples recorded. The UV adhesive suffered four detachments throughout the 11 cycles, making it difficult to collect any meaningful data for the comparison tests. Therefore, this evaluation suggests that UV adhesive may not be a viable attachment method.

All other attachment types returned lower values. The following tables illustrate and quantify the deviations.

Figure 4 shows that all control thermocouple measurements fall within the required limits. This is also true of all readings where high-temperature solder is the attachment method. Notice the reduction in measured temperature with Kapton tape, aluminum tape, and SMD adhesive. This indicates that the attachment method may interfere with the thermocouple/solder pad interface. It is likely that the mass of the tape/adhesive is the cause. As discussed above, the UV adhesive results are inconclusive, as two thermocouples became detached.

Figure 2: control thermocouple capability study chart.

Figure 3: attachment method processing order.

Figure 4: peak temperature comparison by type, 1 mm pads.

Figure 5: peak temperature comparison by type, 5 mm pads.

Figure 6: quantified deviation from capability study x-bar.

Figure 6 quantifies the average deviation experienced for each attachment method. (Again, the UV adhesive results should be disregarded as the readings are influenced by the detachments experienced during the trial.)

These temperature readings suggest that hightemperature solder provides strong mechanical and thermal bonds between the thermocouple and the tested area, and it returns the most accurate results. All other methods delivered temperatures well outside the required specification for accuracy and this should be considered when choosing an attachment medium.

Tests 3 and 7-11 were conducted using the same PCB to study the repetitive use of a “Golden Sample.” The results showed that measured values decreased significantly with each cycle.

Based on the outcomes of this analysis, one could conclude that a “Golden Board” should not be used more than ten times, as there is a significant risk that measured values will fall out of tolerance purely from overuse (Figure 7).

Conclusion

In addition to the thermal profiler instrument’s capability, the method of thermocouple attachment has a significant influence on the accuracy of temperature
readings. This analysis suggests that high-temperature solder is the most reliable attachment medium. Likewise, overuse of a product sample, or “Golden Board”, may result in deterioration of temperature reading accuracy, and this study demonstrates that a limit of ten runs per sample should be considered. Finally, it should be noted that each attachment method’s quality may also impact adhesion and measurement, so future studies should consider multiple suppliers of each material used for thermocouple attachment.

Figure 7: repetitive testing — degradation of measured values.

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Press Release: Touchscreen M.O.L.E. EV6 Thermal Profiler […]

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Touchscreen M.O.L.E. EV6 Thermal Profiler Exceeds Market Launch Expectations

High Demand for Touchscreen Thermal Profiling Control, ECD M.O.L.E.™ EV6 Platform Success Sees Company Set Sights on Next Gamechanger

August 1, 2023 – Launched at the beginning of the year, ECD’s M.O.L.E.™ EV6 thermal profiler has far exceeded initial sales projections, the company announced today. A complete paradigm shift from conventional thermal profiling, M.O.L.E. EV6 delivers handheld access to profiles, calculation templates, pass/fail analysis, and more – on the production floor. No PC download is required to effectively view, analyze, and optimize a thermal profile. According to many ECD partners and early adopters, this technology is long overdue.

Debuted in January with shipments beginning April 2023, the M.O.L.E. EV6 saw record order demand compared to ECD’s previous thermal profiler launch. M.O.L.E. EV6 sales were more than double those of its predecessor during a similar six-month period. According to ECD Electronics Division Manager, Mark Waterman, this validates the team’s innovative vision of what electronics assembly operators and process engineers need to perform their job most effectively.

“Now more than ever, production efficiency is vital to remain competitive in the electronics manufacturing market,” says Waterman. “Touchscreen control and on-thefly data access for immediate corrective actions enables operators to simplify and streamline the profiling process. Productivity is raised, errors reduced, and decisionmaking is informed and immediate.”

While ECD is delighted with the early success of M.O.L.E. EV6’s adoption, Waterman notes that there is plenty more to come: “We anticipate this order trajectory to continue – and even accelerate – as this is truly the most significant thermal profiling product innovation in the last decade,” he says. “The new M.O.L.E. technology platform, along with user input, will influence the development of several other ECD profiling tools we anticipate bringing to market soon. Stay tuned!”

To learn more about M.O.L.E. EV6, its scalable capability with RIDER™ machine quality management tools, or any of ECD’s process control technologies, visit www.ecd.com.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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Press Release: ECD to Showcase Market’s First Touchscreen Thermal Profiler […]

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ECD to Showcase Market’s First Touchscreen Thermal Profiler, Highlight Top Reflow Monitoring Solution at SMTconnect 2023

M.O.L.E.™ EV6 Delivers Factory Floor Handheld Thermal Profiling Control, Pairs Perfectly with OvenSENTINEL™ Reflow Monitoring.

April 25, 2023 – Following a highly-successful Americas launch earlier this year, ECD today announced that its revolutionary M.O.L.E.™ EV6 thermal profiler will be shown live in Europe for the first time during the upcoming SMTconnect 2023 event in Nuremberg, Germany. As the market’s only traveling thermal profiler with full color touchscreen control, M.O.L.E. EV6 frees personnel from the PC, as profile data can be viewed directly on the device. This time-saving solution complements ECD’s award-winning OvenSENTINEL™ reflow monitoring system, which will also be demonstrated at SMTconnect from booth #4-317. As electronics manufacturers look to improve productivity and automate process insight, OvenSENTINEL has seen a doubling of installations year-on-year. When paired, M.O.L.E. EV6 and OvenSENTINEL deliver an unparalleled solution to setting, maintaining, and verifying reflow process parameters for advanced PCB assemblies.

Mike Hayward, ECD EMEA Director of Operations, notes that all ECD’s process control tools – especially M.O.L.E. EV6 and OvenSENTINEL – embody the theme of this year’s SMTconnect event: ‘Driving manufacturing forward’. “M.O.L.E. EV6 marks the most significant development in thermal profiler technology in ten years,” he explains. “Touchscreen control is long overdue in the profiling arena, and we are proud to be the first to bring it to market. Now, users can view and interact with process calculation templates, view profiles, and see pass/fail analysis in the palm of their hand. This simplifies the profiling process, raises productivity, reduces errors, and allows on-the-fly decision-making. Likewise, OvenSENTINEL offers dynamic and customizable real-time monitoring of the reflow process, taking the burden off operators while delivering deep data-supported product traceability – all in an open communications protocol.”

The feature sets of both systems are impressive, with highlights including:

M.O.L.E. EV6:

  • Instrument status display with live temperature readings
  • USB-C communications and charging
  • Wireless capability via Bluetooth
  • Compatible with multiple thermocouple types
  • No PC downloads required; all data displayed on-screen, on the device
  • Built-in calibration reminders for maintenance simplicity
  • Seamlessly integrates with all RIDER™ verification tools: OvenCHECKER™, WaveRIDER™ NL 2, and SelectiveRIDER™ for a complete, multi-process, soldering machine verification system

OvenSENTINEL:

  • Dynamic measurement capabilities with customizable data extractions and sensor types
  • Open architecture, Industry 4.0-enabling
  • Interface supports multiple lanes, ovens, and factories
  • Profile SnapShot™ one-button, on-demand profile confirmation of oven readiness and KPI alignment
  • TrueProfile™ trusted traceability technology

Both M.O.L.E. EV6 and OvenSENTINEL will be displayed in booth #4-317 throughout the three-day SMTconnect exhibition, May 9 – 11. To learn more, visit www.ecd.com or email mike.hayward@ecd.com.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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Press Release: ECD Launches MOLE EV6 Touchscreen […]

M.O.L.E.™ EV6 Delivers Handheld Thermal Profiling Control, Freeing Bakery Operators from Time-consuming, Offline PC Downloads.

March 1, 2023 – Previewed to a select audience at last year’s International Baking Industry Exposition (IBIE), ECD’s M.O.L.E.™ EV6 touchscreen thermal profiler is now commercially available, the company announced today. The market’s first traveling thermal profiler with operation via a capacitive touchscreen, M.O.L.E. EV6 offers a user-friendly, intuitive design engineered to save baking professionals time, simplify data viewing and analysis, and improve productivity. Thermal profiling as a routine practice helps bakers ensure consistent quality and high product yields. With M.O.L.E. EV6, the already simple — but critical — thermal profiling process becomes even more straightforward and less time-constrained.

“Touchscreen control for instrumentation tools is now expected,” says ECD Baking Product Manager, Ray Pearce. “However, it is not ubiquitous. ECD is among the first to break this barrier, helping baking professionals improve processes with instantaneous access to data that enables on-the-fly decision-making for process and product optimization. It’s a game-changer.”

With conventional thermal profiler designs, users must program, download data, and interpret results via a PC interface. In addition, the control buttons on some thermal profilers can be ambiguous and confusing, leading to errors, erased profiles, and other efficiency-killing events if operators are poorly-trained. M.O.L.E. EV6 helps prevent these situations, allowing viewing and interaction with process calculation templates, profile viewing, and pass/fail analysis on the device.

“Productivity and repeatable quality output are the keys to bakery profitability,” says Pearce. “M.O.L.E. EV6 saves time on the line, reduces required training resources, and enables analysis on the production floor for instantaneous product quality and system performance oversight. Prioritizing cost-efficiency, ECD has designed M.O.L.E. EV6 to be practical and affordable with features like an off-the-shelf lithium-polymer battery, wireless Bluetooth operation, and built-in maintenance reminders.

The new thermal profiler integrates with popular ECD baking equipment verification tools and baked goods sensors, CakeOMETER™, BreadOMETER™, VaporWATCH™ and OvenBALANCER™. Shipments begin April 1st.

To learn more, go to this link and/or call +1-503-659-6100


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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Press Release: ECD Debuts Market’s First […]

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ECD Debuts Market’s First Touchscreen-enabled Thermal Profiler

M.O.L.E. EV6 Heralds the Evolution of Thermal Profiling with Smartphone-like, Handheld Data Access, Sets New Benchmark for Factory Floor Profiling Control

January 23, 2023 – With the IPCAPEX EXPO exhibition as the backdrop, ECD unveils its latest process control innovation: M.O.L.E. EV6. The market’s first traveling thermal profiler with operation via a capacitive touchscreen, M.O.L.E. EV6 offers a radical new design engineered to save time, simplify data viewing and analysis, and improve productivity. APEX visitors to ECD Booth #2425 will be the first to see the new technology in person, and will have the opportunity to pre-order M.O.L.E. EV6 for shipments beginning March 1, 2023.

“Consumers have become accustomed to touchscreen-enabled, intuitive management of most of our electronic devices,” says ECD Electronics Division Manager, Mark Waterman. “It should be no different in the factory, and ECD has been moving toward this model for quite a while. We designed our award-winning SmartDRY™ storage system with an easy-to-use onboard user interface, and have now successfully achieved touch control with M.O.L.E. EV6 –all while maintaining the robustness and deep data collection that M.O.L.E. loyalists have come to demand. This is a true evolution in thermal profiling shop floor productivity.”

With conventional thermal profiler designs, users must program, download data and interpret results via a PC interface. Moreover, control buttons on the profiler can be vague and confusing, leading to errors, erased profiles, and other efficiency-killing
events if operators are poorly-trained. M.O.L.E. EV6 eliminates these concerns, delivering process calculation templates, profile viewing, and pass/fail analysis on the device.

“The immediacy of shop floor data access introduces a major boost for productivity,” notes Waterman. “M.O.L.E. EV6 saves time on the line, reduces required training resources, and eliminates the need for a computer to conduct analysis. What’s more, ECD’s engineers have also made M.O.L.E. EV6 practical and affordable with features like an off-the-shelf lithium-polymer battery, wireless Bluetooth operation, and built-in maintenance reminders.”

As with all ECD innovations, M.O.L.E. EV6 is designed from a user mindset, delivering simplicity, robust performance, affordability for high-yield process control, and easy integration with ECD’s machine quality management RIDER pallets.

To learn more, go to this link and plan to visit ECD booth #2425 at IPC APEX EXPO 2023to see M.O.L.E. EV6 live.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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Press Release: ECD to Unveil Reimagined Profiling Technology […]

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ECD to Unveil Reimagined Profiling Technology, Highlight Success of Process Control Portfolio at IPC APEX Expo 2023

Novel Thermal Profiling Capability Set to Improve Data Access; Continuous Reflow Monitoring, Machine Quality Management and Dry Storage Systems Enjoy Market Expansion

December 1, 2022 – ECD, pioneer of the traveling thermal profiler, will debut a brand-new data logging technology from booth #2425 at IPC APEX EXPO 2023 in San Diego, California next month. The novel innovation is designed to accelerate productivity through immediate access to profile statistics for fast decision-making through real-time actionable data. With on-demand demonstrations planned throughout the event, IPC APEX EXPO show delegates can experience ECD’s latest engineering advance first-hand.

In addition to new technology, ECD’s proven tools for high-value PCB assemblies will be on show. As automotive systems, data center server boards and 5G infrastructure technologies increase in complexity and soldering becomes more challenging, manufacturers are looking to solutions like OvenSENTINEL™ continuous reflow monitoring and the MEGAM.O.L.E.™ 20 high-channel-count thermal profiler for robust soldering control to enable high-yield production of high-reliability assemblies. Due to the growth in electric vehicle (EV) volumes, data center capacity, and 5G infrastructure devices, sales of OvenSENTINEL have more than doubled in the last year alone. MEGAM.O.L.E. 20 has likewise experienced notable increases in order volumes. This demand for quality and the assurance of robust equipment operation has also driven steady adoption of ECD’s suite of RIDER™ pallets for machine quality management of wave, reflow and selective soldering systems. All three pallet designs integrate with the SuperM.O.L.E. Gold 2 thermal profiler for a scalable platform approach to shop floor soldering oversight.

Finally, for industries — including electronics — where control of moisture is integral to product quality, ECD’s award-winning SmartDRY™ Intelligent Dry Storage portfolio is enabling exceptional humidity control. With an ultra-fast recovery time of less than three minutes, SmartDRY combines effective dry storage with the ability to access parts frequently for maximum productivity and product integrity assurance. SmartDRY’s unique features and proven performance have allowed it to maintain its leading market share in electronics manufacturing, while expanding into other markets such as 3D printing material storage, medical instrumentation, and filtration. The SmartDRY SD-30 will be on show at ECD booth #2425.

Learn more about ECD’s process control innovations by visiting www.ecd.com. To be among the first to see the company’s revolutionary thermal profiling technology at IPC APEX EXPO 2023, schedule an appointment here.


Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.

Media Contact:

Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com

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