Industry Papers

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RECENTY PUBLISHED


S-CURVE MANAGEMENT — IT’S IN YOUR HANDS

OVERVIEW

There’s an art to baking the perfect loaf. And there’s a lot of science, too. Thorough data about dough transformation is key. Read on to find out how to optimize your baking operation for the BEST results and how new technology may make it even easier to achieve.

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PREVIOUSLY PUBLISHED

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Electronics

Whitepaper - Heat Flow for Reflow

HEAT FLOW FOR REFLOW

(Thermal Profiling)

Controlling the reflow soldering process requires monitoring more than temperature. Heat flow can have a profound influence on the product’s thermal profile.

Whitepaper - How To Get The Best Thermal Profile

HOW TO GET THE BEST THERMAL PROFILE

(Thermal Profiling)

A primer for properly sizing, specifying, and attaching Thermocouples for the Thermal Profiling of electronic assemblies in soldering processes.

Whitepaper - Thermal Profiling: Integral to a Process in Control

THERMAL PROFILING: INTEGRAL TO A PROCESS IN CONTROL

(Thermal Profiling)

The complexity of today’s PCB assemblies with higher densities requires a robust thermal process to ensure high yield manufacturing.  Analyzing and recording the thermal process through thermal profiling is essential to a well-documented operation in control.

Whitepaper - Essential Tools for High-Accuracy Thermal Profiling

ESSENTIAL TOOLS FOR HIGH-ACCURACY THERMAL PROFILING

(Thermal Profiling)

Understanding process heating and heating transfer mediums determine the needed type and size of thermocouple sensor and thermal protecting barrier. Modes of heat transfer, temperature ranges, and duration are all critical variables when measuring temperature.

Whitepaper - 22 Simple Tips for Running Successful Thermal Profiles

22 Simple Tips for Running Successful Thermal Profiles

(Thermal Profiling)

This document provides an easy step‐by‐step guide to help deliver good thermal profiles. Even for a seasoned operator or engineer, it’s easy to forget the little things that can impact the process. Take the time to engage in this quick read; these tips can help you.

THE IMPACT OF THERMOCOUPLE ATTACHMENT METHODS ON THERMAL PROFILING ACCURACY

(Thermal Profiling)

High-reliability electronics manufacturing relies heavily on thermal profiling to ensure reflow soldering process parameters are correctly determined and maintained during printed circuit board (PCB) production.

Whitepaper - Oven vs. Product Profiling

OVEN VS. PRODUCT PROFILING

(Thermal Profiling/Machine Quality Management)

A simple alternative to conventional “golden board” profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.

Whitepaper - How Continuous Reflow Monitoring Supports Lean Manufacturing

HOW CONTINUOUS REFLOW MONITORING SUPPORTS LEAN MANUFACTURING

(Continuous Monitoring)

How the most commonly employed lean manufacturing protocols can be enhanced with robust continuous monitoring technology.

Whitepaper - Is Your Dry Storage J-Standard Compliant?

IS YOUR DRY STORAGE J-STANDARD COMPLIANT?

(Dry Storage)

Learn more about J-STD Compliance and why it’s important for product quality.

Whitepaper - Dispelling Dry Storage Myths

DISPELLING DRY STORAGE MYTHS

(Dry Storage)

An overview of common misconceptions related to component storage and baking.

Baking

BALANCING BAKERY OVENS: A RECIPE FOR SUCCESS

(Oven Balancing)

This paper discusses the importance of oven balancing for line-to-line stability and for ongoing confirmaiton of in-spec baked goods oven performance. Even the slightest variation in oven temperature and/or heat flow can have a dramatic effect on output. Discover how to mitigate these conditions by reading more about establishing a consistent oven balancing routine.

Thermal Profiling for CAKE Products

(Thermal Profiling)

The successful production of cakes, like most bakery products, relies on consistent, repeatable quality that will keep customers coming back. To avoid products that fluctuate in textural attributes like denseness, dryness and crumbliness, mastering and controlling the baking step is crucial. Correct baking time, oven temperature and step profiles can all have a positive impact on cake texture, quality and shelf-life.

ECD Document - Thermal Profiling for Bread Products

Thermal Profiling for Bread Products

(Thermal Profiling)

Thermal profiling or thermal logging is the process of recording the internal temperature of baked goods during the baking cycle. This form of data collection during the baking cycle produces an Scurve, with time on the x-axis and temperature on the y-axis. Rather than relying on the loaf color, exit temperature and time to determine baking conditions, using the S-curve to determine the bake out is a better way to determine a good bake.

3D/Additive

3D Printed Parts Made Reliable by ECD Dry Technology

(Dry Storage)

Fast-recovery dry storage technology is used in electronics, 3D/Additive printing, medical device storage and law enforcement. Read this case study about one 3D printing company’s story.