How Continuous Reflow Monitoring Supports Lean Manufacturing

Cover Industry Papers - Electronics
Whitepaper - How Continuous Reflow Monitoring Supports Lean Manufacturing

OVERVIEW

For optimum efficiency, next-generation continuous monitoring of reflow soldering systems and processes should align with and support lean manufacturing principles. Doing so ensures yield maximization, improvements in profitability, operational cost reductions and increases in quality output. This paper summarizes the most commonly employed lean manufacturing protocols and describes how robust continuous monitoring technology can enhance their effectiveness

KEY LEARNING POINTS:

  • Discussion of the most common lean principles and their purpose
  • Understand how next-generation continuous monitoring of the reflow process aligns with lean principles
  • Quality improvement, better resource management and cost reduction opportunities exist with continuous monitoring as part of an overall lean strategy
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Is Your Dry Storage J-Standard Compliant?

Cover Industry Papers - Electronics
Whitepaper - Is Your Dry Storage J-Standard Compliant?

OVERVIEW

What  is  J-Standard  compliance  and  why  should  you  care?  Is  your operation  in  full  compliance?  Is  your  team  adopting  practices  that may be  sacrificing  compliance?    What’s  your  confidence  level  that  moisture sensitive  components  have  been stored correctly?

KEY LEARNING POINTS:

  • Understand what J-STD compliance is and is not
  • Tools and techniques used to get and maintain compliance and the pros/cons of each
  • Common misconceptions about MSLs that may impact product quality
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Dispelling Dry Storage Myths

Cover Industry Papers - Electronics
Whitepaper - Dispelling Dry Storage Myths

OVERVIEW

Most electronics professionals know it’s important for parts to be dry before sending them through the soldering process. There are, however, some common misconceptions about drying components and the best way to ensure moisture sensitive devices (MSDs) are ready for soldering.

KEY LEARNING POINTS:

  • Learn how dry storage affects the floor life clock of MSL components.
  • Understand different methods to baking out components and their various side-effects.
  • Discover innovative dry storage solutions being integrated into the manufacturing process.
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Oven vs. Product Profiling

Cover Industry Papers - Electronics
Whitepaper - Oven vs. Product Profiling

OVERVIEW

A simple alternative to conventional “golden board” profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.

KEY LEARNING POINTS:

  • A three-channel test vehicle can be used as a surrogate to represent a profile of a populated product.
  • By using a surrogate test vehicle, you can save resources and improve product quality and repeatability.
  • By profiling the oven instead of the product, tremendous production benefits are realized.
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How To Get The Best Thermal Profile

Cover Industry Papers - Electronics
Whitepaper - How To Get The Best Thermal Profile

OVERVIEW

A primer for properly sizing, specifying, and attaching Thermocouples for the Thermal Profiling of electronic assemblies in soldering processes.

KEY LEARNING POINTS:

  • Learn how thermocouples function and are constructed
  • Understand the significance of thermocouple sizing and color-coding
  • Determine the proper thermocouples for a particular application and learn how to properly attach them
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Heat Flow for Reflow

Cover Industry Papers - Electronics
Whitepaper - Heat Flow for Reflow

OVERVIEW

Controlling the reflow soldering process requires monitoring more than temperature. Heat flow can have a profound influence on the product’s thermal profile.

KEY LEARNING POINTS:

  • Learn how thermocouples function and are constructed
  • Understand the significance of thermocouple sizing and color-coding
  • Determine the proper thermocouples for a particular application and learn how to properly attach them
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Industry Papers

Cover - Industry Papers Electronics

ECD’s team of thermal profiling experts have developed a comprehensive series of white paper resources that distill decades of expertise.

Browse our white paper compendium and help yourself to years of knowledge.


RECENTY PUBLISHED


Temperature Precision is Vital

OVERVIEW

There’s an art to baking the perfect loaf. And there’s a lot of science, too. Thorough data about dough transformation is key. Read on to find out how to optimize your baking operation for the BEST results and how new technology may make it even easier to achieve.

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PREVIOUSLY PUBLISHED

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Electronics

ECD’s team of thermal profiling experts have developed a comprehensive series of white paper resources that distill decades of expertise. If you are an electronics professional looking to up your soldering results, comply with the MSD J-STD-033 standard, or pre-empt potential reflow soldering yield-diminishing conditions, there’s something valuable in this library for you.


Whitepaper - Heat Flow for Reflow

HEAT FLOW FOR REFLOW

(Thermal Profiling)

Controlling the reflow soldering process requires monitoring more than temperature. Heat flow can have a profound influence on the product’s thermal profile.

Whitepaper - How To Get The Best Thermal Profile

HOW TO GET THE BEST THERMAL PROFILE

(Thermal Profiling)

A primer for properly sizing, specifying, and attaching Thermocouples for the Thermal Profiling of electronic assemblies in soldering processes.

Whitepaper - Thermal Profiling: Integral to a Process in Control

THERMAL PROFILING: INTEGRAL TO A PROCESS IN CONTROL

(Thermal Profiling)

The complexity of today’s PCB assemblies with higher densities requires a robust thermal process to ensure high yield manufacturing.  Analyzing and recording the thermal process through thermal profiling is essential to a well-documented operation in control.

Whitepaper - Essential Tools for High-Accuracy Thermal Profiling

ESSENTIAL TOOLS FOR HIGH-ACCURACY THERMAL PROFILING

(Thermal Profiling)

Understanding process heating and heating transfer mediums determine the needed type and size of thermocouple sensor and thermal protecting barrier. Modes of heat transfer, temperature ranges, and duration are all critical variables when measuring temperature.

Whitepaper - 22 Simple Tips for Running Successful Thermal Profiles

22 Simple Tips for Running Successful Thermal Profiles

(Thermal Profiling)

This document provides an easy step‐by‐step guide to help deliver good thermal profiles. Even for a seasoned operator or engineer, it’s easy to forget the little things that can impact the process. Take the time to engage in this quick read; these tips can help you.

THE IMPACT OF THERMOCOUPLE ATTACHMENT METHODS ON THERMAL PROFILING ACCURACY

(Thermal Profiling)

High-reliability electronics manufacturing relies heavily on thermal profiling to ensure reflow soldering process parameters are correctly determined and maintained during printed circuit board (PCB) production.

Whitepaper - Oven vs. Product Profiling

OVEN VS. PRODUCT PROFILING

(Thermal Profiling/Machine Quality Management)

A simple alternative to conventional “golden board” profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.

Whitepaper - How Continuous Reflow Monitoring Supports Lean Manufacturing

HOW CONTINUOUS REFLOW MONITORING SUPPORTS LEAN MANUFACTURING

(Continuous Monitoring)

How the most commonly employed lean manufacturing protocols can be enhanced with robust continuous monitoring technology.

SELECTIVE SOLDERING: HOW DO YOU KNOW IF YOUR MACHINE IS IN SPEC?

(Selective Soldering)

Selective soldering offers benefits like protecting temperature-sensitive components, optimizing processes, and reducing material and energy consumption..

Whitepaper - Is Your Dry Storage J-Standard Compliant?

IS YOUR DRY STORAGE J-STANDARD COMPLIANT?

(Dry Storage)

Learn more about J-STD Compliance and why it’s important for product quality.

Whitepaper - Dispelling Dry Storage Myths

DISPELLING DRY STORAGE MYTHS

(Dry Storage)

An overview of common misconceptions related to component storage and baking.

Baking

If you’re running an artisanal or commercial bakery and want to know how to use data to elevate your baking results, speed new product introductions, or ensure you pass FSMA Kill Step compliance audits with flying colors, ECD’s white paper collection can help.


BALANCING BAKERY OVENS: A RECIPE FOR SUCCESS

(Oven Balancing)

This paper discusses the importance of oven balancing for line-to-line stability and for ongoing confirmaiton of in-spec baked goods oven performance. Even the slightest variation in oven temperature and/or heat flow can have a dramatic effect on output. Discover how to mitigate these conditions by reading more about establishing a consistent oven balancing routine.

Thermal Profiling for CAKE Products

(Thermal Profiling)

The successful production of cakes, like most bakery products, relies on consistent, repeatable quality that will keep customers coming back. To avoid products that fluctuate in textural attributes like denseness, dryness and crumbliness, mastering and controlling the baking step is crucial. Correct baking time, oven temperature and step profiles can all have a positive impact on cake texture, quality and shelf-life.

ECD Document - Thermal Profiling for Bread Products

Thermal Profiling for Bread Products

(Thermal Profiling)

Thermal profiling or thermal logging is the process of recording the internal temperature of baked goods during the baking cycle. This form of data collection during the baking cycle produces an Scurve, with time on the x-axis and temperature on the y-axis. Rather than relying on the loaf color, exit temperature and time to determine baking conditions, using the S-curve to determine the bake out is a better way to determine a good bake.

3D/Additive

3D Printed Parts Made Reliable by ECD Dry Technology

(Dry Storage)

Fast-recovery dry storage technology is used in electronics, 3D/Additive printing, medical device storage and law enforcement. Read this case study about one 3D printing company’s story.