M.O.L.E. MAP Software

SOFTWARE TO MAKE YOUR LIFE EASIER

M.O.L.E.® MAP is ECD’s software for setup, download, analysis, prediction and data storage that is compatible with all EV Series, MEGA Series and thermal profilers and the original SuperM.O.L.E.® Gold thermal profiler.

“MAP” stands for Machine (reflow oven), Assembly (test article) and Process (solder paste). Our aim is to help Engineers optimize their Machine-Assembly-Process, and we know that time is money. M.O.L.E. MAP software is designed to be Easy-to-Use, Flexible and Robust…no small undertaking.

Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of your .MDM M.O.L.E. libraries and compatibility with your intranet, Excel, and all ECD M.O.L.E. thermal profilers? M.O.L.E. MAP is the Gold Standard for thermal profiling software.

Key Features


5 START WIZARDS:

  • Fresh Start: For 1st time new Machine, Assembly or Process (MAP) run situations
  • Tweak Existing: To starting a new profile based upon an existing previous run
  • Download Data: Start a new profile by just downloading the M.O.L.E. profiler
  • Create Target™ 10 Specification: Steps you through Target-10 Specs setup on a specific profile for OK button equipped M.O.L.E.’s and software verification
  • Verify Process: Steps you through the T-10 MAP verification process

TARGET-10™

  • A clear and powerful Green/Red “Go / No-Go” result indication on the M.O.L.E. itself
  • Analog gauges in MAP for intuitive ‘quick glance’ data interpretation
  • Drill down Data for engineering analysis
  • Configurability, so you can delegate decision-making

EASY NAVIGATION AND FILE SHARING

  • Quickly get back to your previous session with links to your recent profiles and directories on the MAP Welcome screen.
  • Share multiple .mdm and .xmg profiles outside your intranet with the new bulk import feature. Convert old SMG Workbooks into new MAP Directories too.
  • When a picture is enough, email or print a PDF report in a preferred page layout directly from MAP for process documentation travelers

M.O.L.E. STATUS

  • A quick pre-flight check makes it easy to avoid a wasted run. Knowing of a broken thermocouple, a discharged battery, or full memory in advance saves you time and effort

INTERACTIVE PREDICTION

  • A great assist for recipe development means you can make quick adjustments to a profile just made or any run in any MAP Directory. Use the conveyor speed slider and drag zone temperatures against a backdrop of temperature curves and paste spec polygons or Target 10 gauges and ´move the needles to green´ to make the Machine best match the Assembly and Process for that perfect reflow recipe.

CUSTOMIZABLE DATA EXTRACTION

  • Get the data you want, the way you want it. For example, cluster thermocouples for comparison of temperature gradients across components, or entire PCB. A wizard steps you through the selections for existing and additional Data columns

MAP PROCESS DOCUMENTATION

  • Documentation Complete with Oven and Solder Paste Databases you can easily add to, Preferences can be set once or customized to various product and production lines.

RECIPE GENERATOR

  • Used within MAP software’s reflow environment to help generate oven recipe set points. This allows users to leverage this knowledge base for reflow profiling recipes that are as easy as 1-2-3. Use simple pre-loaded, drop down menus to:
    • Specify reflow oven equipment type
    • Identify board thickness and component density
    • Select solder paste type

Specifications


Software Media:USB Drive or direct download
Operation:Requires a SuperM.O.L.E.™ Gold, SuperM.O.L.E.™ Gold 2, M.O.L.E.® EV6, M.O.L.E.® EV12, V-M.O.L.E.™, V-M.O.L.E.™ 2, MEGAM.O.L.E.™ 20, M.O.L.E.® EV20 or Text data files
PC Hardware:300mhz processor or equivalent, 4 gigabytes of RAM (minimum), 200 megabytes of free disk space
Operating System:Windows 10 or 11
Display:1024 x 768
Installations:Unlimited

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Contact Us


ECD NORTH AMERICA (US, CANADA)

Worldwide Headquarters
4287-B SE International Way
Milwaukie, Oregon 97222-8825 U.S.A.

sales@ecd.com

support@ecd.com

1.503.659.6100

1.800.323.4548

ECD Partner Network

ECD Partner Network – NA

LATAM (MEXICO, CENTRAL, SOUTH AMERICA)
EMEA (EUROPE, MIDDLE EAST, AFRICA)
APAC (ASIA-PACIFIC, CHINA, INDIA)

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Product Support


M.O.L.E. MAP Software

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PRODUCT DOWNLOADS

  • Datasheet: Letter | A4 | Spanish | Chinese
  • ECD Product Catalog: English | Spanish
PDF

INDUSTRY RESOURCES

Industrial

Industrial Cover

Whether employing conveyorized ovens for metal finishing, automotive, aerospace, or countless other industrial manufacturing processes, ensuring the highest-quality results requires thermal measurement of the product to understand in-oven performance and adhere to specifications. Our M.O.L.E.® thermal profilers, in combination with INDATA® thermal barriers and thermocouples, provide a customized approach to product quality assurance. The portable M.O.L.E travels with parts through conveyorized ovens and furnaces, making long feed-and-retrieve sensor wires obsolete and simplifying process validation.


Is your thermal process control routine time-consuming and complex? Discover the simplicity of M.O.L.E. thermal profilers.

Time and Temperature Profiling

ECD pioneered traveling time/temperature profiling technology, engineering the M.O.L.E.® thermal profiler which has become the industry standard across multiple market sectors. The same principles of thermal measurement, specification adherence and in-process data acquisition apply to industrial processes apply. Using precise temperature measurement to set process parameters, validate in-process performance and conduct deep data analysis ensures exceptional yield and high-quality results.

Though there are different models, the most popular M.O.L.E. kits for industrial oven processing consist of a M.O.L.E.® EV6 combined with INDATA® thermal barriers and thermocouples. The entire kit is customized based on specific time and temperature conditions alongside space considerations. The workflow-adaptable M.O.L.E.® MAP software platform delivers tailored data extractions that optimize thermal processing parameters and provide process insight and analysis.


Market Sectors and Applications

Precision measurement and ongoing control of process time and temperature directly correlate to manufacturing throughput, yield, and product quality. With M.O.L.E. thermal profiling solutions, ECD has helped customers in numerous industries achieve exceptional results that elevate brand reputation and business profitability. Our customers’ market sectors include:

  • Aluminum Fabrication
  • Automotive
  • Baking & Food Processing
  • Carpet & Textiles
  • Electronics & Semiconductor
  • Ferrous Heat Treating
  • Glass Manufacturing
  • Golf Clubs & Sports Equipment
  • Hand Tools
  • MDF Cabinetry
  • Medical
  • Military/Aerospace
  • Plastics & Rotomoulding
  • Powder Coating
  • Powder Metallurgy
  • Smart Grid
  • Solar PV Manufacturing
  • Tractors & Lawn Mowers

PROCESS DEVELOPMENT

Thermal Profiling Products

Six-channel thermal profilers are the most effective for process heating applications. For specific processes –such as furnace surveys or new product development, for example — where more data points are required, the 20-channel MEGAM.O.L.E.® is recommended.

  • Three-channel V-M.O.L.E.® best for smaller parts and narrower conveyance.
  • Six-channel SuperM.O.L.E.® Gold 2 with RF for wireless real-time process profile monitoring.
  • 20-channel MEGAM.O.L.E.® for Furnace and Survey applications.

As each process is unique, it is best to consult with an ECD expert to assess the ideal M.O.L.E. for your requirements.

M.O.L.E.® EV6

[6-Channels]

V-M.O.L.E.™ 2

[4-Channels]

M.O.L.E.® EV20

[20-Channels]

INDATA® Thermal Barrier Collection

A thermal barrier is an insulation and a passive heat sink that protects M.O.L.E.® thermal profilers from oven heat exposure.

INDATA 105

[Heat Treating]

INDATA 130

[Heat Treating]

INDATA 135

[Curing]

Thermocouples

All ECD thermocouples are specifically designed and tested for thermal profiling applications. A broad product line includes thermocouples for electronic production, industrial manufacturing, food processing and baking, as well as high-temperature annealing.

Glass

[900°F/482°C]

Stainless Steel Overbraid

[900°F/482°C]

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