EL-Electronics Archives

Thermal Profiling – Integral to a Process in Control

OVERVIEW

The complexity of today’s PCB assemblies with higher densities requires a robust thermal process to ensure high yield manufacturing. Analyzing and recording the thermal process through thermal profiling is essential to a well-documented operation in control.

KEY LEARNING POINTS:

Thermal Profiling is Critical to Good Process Control
How to Successfully Profile the PCB or the Reflow Oven
Analyzing the Profile Results: What do they mean?
Why Traceability is Essential for Compliance and Liability

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How Continuous Reflow Monitoring Supports Lean Manufacturing

OVERVIEW

For optimum efficiency, next-generation continuous monitoring of reflow soldering systems and processes should align with and support lean manufacturing principles. Doing so ensures yield maximization, improvements in profitability, operational cost reductions and increases in quality output. This paper summarizes the most commonly employed lean manufacturing protocols and describes how robust continuous monitoring technology can enhance their effectiveness

KEY LEARNING POINTS:

Discussion of the most common lean principles and their purpose
Understand how next-generation continuous monitoring of the reflow process aligns with lean principles
Quality improvement, better resource management and cost reduction opportunities exist with continuous monitoring as part of an overall lean strategy

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Is Your Dry Storage J-Standard Compliant?

OVERVIEW

What is J-Standard compliance and why should you care? Is your operation in full compliance? Is your team adopting practices that may be sacrificing compliance? What’s your confidence level that moisture sensitive components have been stored correctly?

KEY LEARNING POINTS:

Understand what J-STD compliance is and is not
Tools and techniques used to get and maintain compliance and the pros/cons of each
Common misconceptions about MSLs that may impact product quality

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Dispelling Dry Storage Myths

OVERVIEW

Most electronics professionals know it’s important for parts to be dry before sending them through the soldering process. There are, however, some common misconceptions about drying components and the best way to ensure moisture sensitive devices (MSDs) are ready for soldering.

KEY LEARNING POINTS:

Learn how dry storage affects the floor life clock of MSL components.
Understand different methods to baking out components and their various side-effects.
Discover innovative dry storage solutions being integrated into the manufacturing process.

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Oven vs. Product Profiling

OVERVIEW

A simple alternative to conventional “golden board” profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.

KEY LEARNING POINTS:

A three-channel test vehicle can be used as a surrogate to represent a profile of a populated product.
By using a surrogate test vehicle, you can save resources and improve product quality and repeatability.
By profiling the oven instead of the product, tremendous production benefits are realized.

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How To Get The Best Thermal Profile

OVERVIEW

A primer for properly sizing, specifying, and attaching Thermocouples for the Thermal Profiling of electronic assemblies in soldering processes.

KEY LEARNING POINTS:

Learn how thermocouples function and are constructed
Understand the significance of thermocouple sizing and color-coding
Determine the proper thermocouples for a particular application and learn how to properly attach them

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Heat Flow for Reflow

OVERVIEW

Controlling the reflow soldering process requires monitoring more than temperature. Heat flow can have a profound influence on the product’s thermal profile.

KEY LEARNING POINTS:

Learn how thermocouples function and are constructed
Understand the significance of thermocouple sizing and color-coding
Determine the proper thermocouples for a particular application and learn how to properly attach them

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Machine Quality Management

Making sure thermal processes operate within spec encompasses several elements, with one of the most critical being equipment function. Leveraging independent tools – as opposed to equipment supplier systems — to confirm machine performance is the ultimate second opinion. ECD’s machine verification technologies seamlessly integrate with M.O.L.E.® thermal profilers for a simple approach to machine quality management.

Trust, but verify, with ECD machine quality management tools. Learn more.

Electronics

Process Test Pallets

Machine Quality Management (MQM) tools ensure soldering equipment – whether reflow, wave, or selective – is performing to specifications. Keeping a machine operating within its set tolerances sets a good foundation for product quality and high-yield operations. ECD MQM pallets use the M.O.L.E.® thermal profiler as the data collection device, enabling the use of one data acquisition system that can be used across soldering equipment platforms.

OvenRIDER® NL 2+

[Reflow Soldering]

SOLUTION PREVIEW

OVERVIEW

KEY LEARNING POINTS:

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OVERVIEW

KEY LEARNING POINTS:

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OVERVIEW

KEY LEARNING POINTS:

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OVERVIEW

KEY LEARNING POINTS:

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OVERVIEW

KEY LEARNING POINTS:

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OVERVIEW

KEY LEARNING POINTS:

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OVERVIEW

KEY LEARNING POINTS:

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Electronics

Process Test Pallets

OvenRIDER® NL 2+

SelectiveRIDER®

WaveRIDER® NL 2

Fluxometer™

Verification

Reflow Validator™

Get the Inside Scoop

Electronics

Thermal Profiling for Printed Circuit Board (PCB) Assembly

M.O.L.E.® EV6

M.O.L.E.® EV12

M.O.L.E.® EV20

V-M.O.L.E.™ 2

Side Rider™

Reflow Rider™

EZ Rider™

Board Carrier™

Thermal Barriers

Thermocouples

Thermocouple Adaptors

Thermocouple Attachment

Baking

Thermal Profiling for Baking

M.O.L.E.® EV6 Baking

V-M.O.L.E.™ 2

Thermocouples

Thermocouple Spreader

Industrial

Thermal Profiling Products

M.O.L.E.® EV6

V-M.O.L.E.™ 2

M.O.L.E.® EV20

Solar

Thermal Profiling Products

V-M.O.L.E.™ 2 Solar

M.O.L.E.® EV20

Get the Inside Scoop

ECD Electronics Industry Ecosystem

PROCESS DEVELOPMENT & VALIDATION

USER INTERFACE, ANALYSIS & OPTIMIZATION

MACHINE QUALITY MANAGEMENT

COMPONENT DRY STORAGE

PROCESS DEVELOPMENT & VALIDATION

Thermal Profiling for Printed Circuit Board (PCB) Assembly

M.O.L.E.® EV6

M.O.L.E.® EV12

M.O.L.E.® EV20

V-M.O.L.E.™ 2

Side Rider™

Reflow Rider™

EZ Rider™

Board Carrier™

Thermal Barriers

Thermocouples

Thermocouple Adaptors

Thermocouple Attachment