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ECD Vapor Phase Thermal Profiling Solution to Make European Debut at Productronica 2025
Sleek and Rugged Vapor Phase Barrier Completes Total Solder Process Profiling Portfolio, Delivers Single Profiler Scalability for Reflow, Wave, Vapor Phase, and Selective Soldering.
October 22, 2025 – ECD will unveil its thermal profiling solution for vapor phase soldering to the European market at Productronica 2025, the company announced today. Visitors to the electronics fair can see ECD’s M-VP™ sealed barrier and touchscreen M.O.L.E.® EV6 thermal profiler at stand A4.141 alongside the company’s complete line of machine quality management, reflow monitoring, and thermal profiling technologies.
Vapor phase soldering is renowned for its reliable, high-quality soldering results, particularly for high-thermal-mass, high-complexity PCB assemblies. Vapor phase reflow processes – especially those with vacuum – are also known for their profiling difficulty due to the harsh, high-temperature environment. ECD’s M-VP sealed barrier has overcome this challenge, delivering a rugged, chemical-resistant, and easy-to-use design that is compatible with both batch and in-line vapor phase systems, with or without vacuum. With the combination of M-VP and M.O.L.E. EV6, high-accuracy data collection can be achieved and real-time results viewed without the risk of thermal profiler damage.
The M-VP sealed barrier is a much-anticipated vapor phase solution, as ECD EMEA Director of Operations Mike Hayward explains.
“Delivering a vapor phase barrier that can be easily integrated with any ECD six-channel M.O.L.E. thermal profiler now completes our modular process control line-up; all soldering equipment types — wave, reflow, selective, and vapor phase soldering – are addressed, and we have delivered what the market demands,” notes Hayward. “In fact, during the previous Productronica event, numerous visitors specifically requested a vapor phase solution which we have now commercialized and are excited to demonstrate at this year’s trade fair.”
M-VP’s notable features include:
- Strong, impervious, water-tight design
- Easy open/close clips, no screws
- Bluetooth®-enabled for real-time process oversight
- Survives temperatures up to 260° C
- Rugged construction: contaminant-resistant and withstands harsh environments with no degradation under vacuum
Like all ECD products, M-VP is engineered to deliver exceptional performance and is designed with operators and the production environment in mind. The barrier materials, easy access mechanisms, and rugged structural integrity were equal priorities in the development of this useful and effective tool.
ECD invites all Productronica 2025 show delegates to visit stand A4.141 and experience ECD’s broad scope of soldering process control solutions, including the distinguished M-VP and M.O.L.E. EV6, in person. Learn more at www.ecd.com or email mike.hayward@ecd.com to schedule a meeting at Productronica.
Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere
About ECD
Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems. For more information on ECD and its products, visit www.ecd.com.
Media Contact:
Laura Sims
Sims Communications, Inc.
(o) 770-829-4757
(m) 404-661-0348
laura@simscomm.com
