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SELECTIVE SOLDERING — HOW DO YOU KNOW IF YOUR MACHINE IS IN SPEC?
Selective soldering has seen dramatic growth recently, as manufacturers seek alternatives to wave soldering. The selective application of molten solder to targeted components provides many benefits including protection of temperature-sensitive componentry, process optimization and high-reliability solder joints. Using selective soldering methods can also lead to material reduction (solder, flux, nitrogen), eliminate specific tasks (masking, rework, cleaning etc.) and reduce energy consumption (less solder to keep molten than in wave equipment). However, like any process involving people and mechanical systems, selective soldering success depends on many variables.
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HEAT FLOW FOR REFLOW
Controlling the reflow soldering process requires monitoring more than temperature. Heat flow can have a profound influence on the product’s thermal profile.
HOW TO GET THE BEST THERMAL PROFILE
A primer for properly sizing, specifying, and attaching Thermocouples for the Thermal Profiling of electronic assemblies in soldering processes.
THERMAL PROFILING: INTEGRAL TO A PROCESS IN CONTROL
The complexity of today’s PCB assemblies with higher densities requires a robust thermal process to ensure high yield manufacturing. Analyzing and recording the thermal process through thermal profiling is essential to a well-documented operation in control.
ESSENTIAL TOOLS FOR HIGH-ACCURACY THERMAL PROFILING
Understanding process heating and heating transfer mediums determine the needed type and size of thermocouple sensor and thermal protecting barrier. Modes of heat transfer, temperature ranges, and duration are all critical variables when measuring temperature.
22 Simple Tips for Running Successful Thermal Profiles
This document provides an easy step‐by‐step guide to help deliver good thermal profiles. Even for a seasoned operator or engineer, it’s easy to forget the little things that can impact the process. Take the time to engage in this quick read; these tips can help you.
OVEN VS. PRODUCT PROFILING
(Thermal Profiling/Machine Quality Management)
A simple alternative to conventional “golden board” profiling offers quality assurance and repeatability for high-mix, low-volume manufacturing operations.
HOW CONTINUOUS REFLOW MONITORING SUPPORTS LEAN MANUFACTURING
How the most commonly employed lean manufacturing protocols can be enhanced with robust continuous monitoring technology.
IS YOUR DRY STORAGE J-STANDARD COMPLIANT?
Learn more about J-STD Compliance and why it’s important for product quality.
DISPELLING DRY STORAGE MYTHS
An overview of common misconceptions related to component storage and baking.
Thermal Profiling for Bread Products
Thermal profiling or thermal logging is the process of recording the internal temperature of baked goods during the baking cycle. This form of data collection during the baking cycle produces an Scurve, with time on the x-axis and temperature on the y-axis. Rather than relying on the loaf color, exit temperature and time to determine baking conditions, using the S-curve to determine the bake out is a better way to determine a good bake.
Thermal Profiling for CAKE Products
The successful production of cakes, like most bakery products, relies on consistent, repeatable quality that will keep customers coming back. To avoid products that fluctuate in textural attributes like denseness, dryness and crumbliness, mastering and controlling the baking step is crucial. Correct baking time, oven temperature and step profiles can all have a positive impact on cake texture, quality and shelf-life.
3D Printed Parts Made Reliable by ECD Dry Technology
Fast-recovery dry storage technology is used in electronics, 3D/Additive printing, medical device storage and law enforcement. Read this case study about one 3D printing company’s story.