Description
M-VP™ Sealed Barrier is designed to withstand the rigors of vapor phase soldering, protecting the ECD M.O.L.E.® EV6 thermal profiler. With a rugged seal and vacuum ready construction, the M-VP thermal barrier offers fail-safe thermal profiler protection to ensure reliable, precise in-process data capture while minimizing its impact on the process. Adding the M-VP to ECD’s barrier portfolio now ensures total scalability, enabling the use the award-winning touchscreen M.O.L.E. EV6 with any soldering equipment platform – reflow, wave, selective, and vapor phase.
Please note that official quotes will be issued beginning mid March with orders shipping early April.
Dimensions (L x W x H):
- 203.2mm (8.0”) x 123.5mm (4.9”) x 38.1mm (1.5”)
Weight:
- 837 grams (1.842 lb)
Included Items:
- M-VP Sealed Barrier
- Guide and Care Instructions