Sep 2009 U.S. TECH Article by Paul Austen, ECD - "How Important Is Thermal Profiling?"
Sep 27, 2009
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Sep 2009 U.S. TECH Article by Paul Austen, ECD - "How Important Is Thermal Profiling?" |
Filed under: Thermal Profiling, Oven Profiling, Ovens, High-Volume Production, PCB, Reflow, Thermal Profiler, PC Board Assembly, Thermal Profiler (aka M.O.L.E.), Circuit Board Components, Yield improvement, Oven Verification, J-STD-075, passive component degredation