Thermal Profilinghttp://ecd.com/media/media/g/thermal_profiling/default.aspxenCommunityServer 2008.5 SP2 (Build: 40407.4157)08-11-10 Lead-Free In Mission Critical: Failure Is Not An Option, by Grant Peterson, V.P at ECDhttp://ecd.com/media/media/p/58.aspxThu, 12 Aug 2010 18:30:11 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:58Liz Richards0<p>By Grant Peterson for&nbsp;SMT online&nbsp;8-11-10, article suggests that to confidently use lead-free in high-rel apps, it&#39;s prudent to step back and determine...</p>Reflow Soldering: The Basics - Paul Austen Blog (full article) http://ecd.com/media/media/p/54.aspxMon, 24 May 2010 15:10:01 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:54Liz Richards0<p>A brief overview of the processes.</p>Sep 2009 U.S. TECH Article by Paul Austen, ECD - "How Important Is Thermal Profiling?" http://ecd.com/media/media/p/28.aspxSun, 27 Sep 2009 21:59:09 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:28Liz Richards0Process Improvements Through Thermal Profilinghttp://ecd.com/media/media/p/9.aspxTue, 21 Jul 2009 18:23:06 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:9Todd Clifton0<p>The goal of thermal profiling is to always increase quality and reduce waste. Three case histories - covering powder coating, baking and solder reflow applications.</p>Thermal profiling optimizes printed circuit board assemblyhttp://ecd.com/media/media/p/8.aspxMon, 20 Jul 2009 20:55:55 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:8Todd Clifton0<p>Today&rsquo;s challenges in thermal profiling: Although the electronics industry is often regarded as mature, new challenges continually occur. Some of these challenges, such as smaller parts and lead-free assemblies, require further development or modification of equipment, or changes in the control software.</p>Improve Solder Scavenging of Large Area-array Siteshttp://ecd.com/media/media/p/7.aspxMon, 20 Jul 2009 20:51:16 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:7Todd Clifton0<p>After BGA removal for repair,there typically is an excess of solder remaining on the board side, which can cause short circuits by bridging between adjacent joints and/or open circuits by preventing the complete collapse of all joints.</p>Oven vs. Board Profiling For the Production Environmenthttp://ecd.com/media/media/p/6.aspxMon, 20 Jul 2009 20:47:26 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:6Todd Clifton0<p>Thermal Profiling is a recognized necessity. As mid-to-high volume production continues to dominate in many areas, it is beneficial to understand the available choices in profiling...</p>Thermal profiling: A key element of process controlhttp://ecd.com/media/media/p/5.aspxMon, 20 Jul 2009 20:43:48 GMT4de99ecc-b9a0-4a23-af4b-c334e90054f8:5Todd Clifton0<p>How can manufacturers ensure process control and still achieve speed of throughput in the electronics industry? Thermal profiling, as an element of process control, provides many solutions.</p>