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08-11-10 Lead-Free In Mission Critical: Failure Is Not...
By Grant Peterson for SMT online 8-11-10, article suggests that to confidently use lead-free in...
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Aug 12, 2010
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99
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0
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Reflow Soldering: The Basics - Paul Austen Blog (full article...
A brief overview of the processes.
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May 24, 2010
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601
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Sep 2009 U.S. TECH Article by Paul Austen, ECD - "How...
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Sep 27, 2009
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707
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Process Improvements Through Thermal Profiling
The goal of thermal profiling is to always increase quality and reduce waste. Three case histories...
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Jul 21, 2009
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174
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Thermal profiling optimizes printed circuit board assembly
Today’s challenges in thermal profiling: Although the electronics industry is often regarded...
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Jul 20, 2009
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595
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Improve Solder Scavenging of Large Area-array Sites
After BGA removal for repair,there typically is an excess of solder remaining on the board side...
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Jul 20, 2009
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609
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Oven vs. Board Profiling For the Production Environment
Thermal Profiling is a recognized necessity. As mid-to-high volume production continues to dominate...
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Jul 20, 2009
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564
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Thermal profiling: A key element of process control
How can manufacturers ensure process control and still achieve speed of throughput in the electronics...
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Jul 20, 2009
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696
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